Taiwan’s E-Chem expands footprint in semiconductor chemicals, targets global growth
As global demand for advanced semiconductor packaging surges, Taiwanese specialty chemicals and materials maker E-Chem is investing aggressively to seize…
Qualcomm launches AI Acceleration Initiative at Beijing summit to advance edge AI deployment
Qualcomm China chairman Frank Meng introduced the “AI Acceleration Initiative” at a Beijing event on September 24, aiming to enhance…
Commentary: OpenAI faces two major challenges after cash infusion
Following Nvidia’s plan to invest up to US$100 billion in OpenAI, six of the seven major US tech giants—excluding Tesla—have…
Samsung breaks silence on 12-layer HBM3E validation
Samsung Electronics is expected to confirm by late September 2025 that its 12-layer fifth-generation high-bandwidth memory (HBM3E) has cleared customer…
Why DeepSeek’s R2 still isn’t here: Liang Wenfeng’s balancing act
On September 22, DeepSeek released the upgraded DeepSeek-V3.1-Terminus model through its API platform and quickly made it open source. The…
When LLMs outgrow the chip: Huawei’s P/D separation redefines design choices
At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined…
Qualcomm ramps up Snapdragon branding in bid to lead AI PC market
At the opening keynote of the Snapdragon Summit 2025, Don McGuire, Senior Vice President and Chief Marketing Officer of Qualcomm,…
China positions BeiDou satellites as a global alternative to GPS
China is fast-tracking the BeiDou Navigation Satellite System (BDS), broadening its ecosystem from core infrastructure to commercial applications and positioning…
Infineon, Rohm sign MOU to support flexible SiC power device shipments
Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer…