https://prabadinews.com/
  • October 9, 2026
  • Last Update July 17, 2026 9:28 pm
  • United States of America

Infineon, Rohm sign MOU to support flexible SiC power device shipments

Infineon, Rohm sign MOU to support flexible SiC power device shipments

Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate on packages for silicon carbide (SiC) power semiconductors.

administrator

Related Articles