China capacity expansion and weakening end-market demand prompt cost reductions for 28nm process
The 28-nanometer process has become the most popular node among mature processes. It boasts the highest utilization rates and the…
Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks
Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with…
Commentary: Nvidia’s Groq deal reshapes semiconductor industry in 3 key ways
The biggest recent news in AI chip development is Nvidia’s non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion…
Samsung reportedly explores side-by-side chip packaging for next-gen Exynos
Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,…
AI competition moves beyond LLMs into distribution and hardware channels
As frontier AI models reach practical usability, competition is shifting from incremental improvements in model performance to a broader battle…
2026 AI server demand tied to profitable AI as unmonetizable projects stall
As AI adoption accelerates, global and US economies in 2025 have been increasingly driven by technology companies’ investments in AI…
