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  • October 9, 2026
  • Last Update July 17, 2026 9:28 pm
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Samsung and SK Hynix to unveil next-gen memory tech at ISSCC 2026

Samsung and SK Hynix to unveil next-gen memory tech at ISSCC 2026

At the upcoming International Solid-State Circuits Conference (ISSCC) 2026 in February, Samsung Electronics and SK Hynix are set to unveil significant advances in high-performance memory. Samsung plans to showcase a redesigned 6th-generation high-bandwidth memory (HBM4) delivering 3.3TB/s of bandwidth, while SK Hynix will introduce its latest high-speed LPDDR6 and GDDR7 products.

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