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  • October 8, 2026
  • Last Update July 17, 2026 9:28 pm
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K&S partners with Taiwanese semiconductor leaders in advanced packaging push

K&S partners with Taiwanese semiconductor leaders in advanced packaging push

Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore’s semiconductor packaging equipment giant Kulicke & Soffa (K&S) has confirmed its close collaboration with Taiwan’s semiconductor foundry leaders in the advanced packaging field for high-end chips.

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