https://prabadinews.com/
  • October 8, 2026
  • Last Update July 17, 2026 9:28 pm
  • United States of America

InPsytech finalizes UCIe 2.0 compliant SoIC design for 3D heterogeneous integration

InPsytech finalizes UCIe 2.0 compliant SoIC design for 3D heterogeneous integration

InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIe 2.0 (Universal Chiplet Interconnect Express) standard. This marks a significant achievement for high-speed interconnect capability for heterogeneous integrated chips.

administrator

Related Articles