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  • October 10, 2026
  • Last Update July 17, 2026 9:28 pm
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Huawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV

Huawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV

A newly released filing from China’s National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal line patterning using only deep ultraviolet (DUV) lithography — potentially bypassing US export restrictions on advanced tools. The South China Morning Post reports the technique can create metal pitches under 21nm, a requirement typically met only with ASML’s top-tier extreme ultraviolet (EUV) exposure systems, which remain off-limits to Huawei.

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