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  • October 7, 2026
  • Last Update July 17, 2026 9:28 pm
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Hanmi Semiconductor expands into advanced chip packaging for AI era

Hanmi Semiconductor expands into advanced chip packaging for AI era

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem. After establishing dominance in the critical thermal compression bonding (TCB) segment used for high-bandwidth memory (HBM), the company has now officially entered the advanced system semiconductor packaging market.

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