Samsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers…
Smartphones and notebook prices could increase as memory lead times extend
Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers,…
Happy New Year!
Happy New Year to all of you! 2025 flew by here at Healthcare IT Today. Hopefully it was an amazing…
Time’s up: Enhanced ACA subsidies expire
The expanded tax credits are officially dead after lawmakers failed to secure an extension before the end-of-year deadline. There’s still…
1092: Should hot or cold compresses be used to treat extravasation?
Show notes at pharmacyjoe.com/episode1092 In this episode, I’ll discuss when to use a cold or warm compress to treat extravasation.
China capacity expansion and weakening end-market demand prompt cost reductions for 28nm process
The 28-nanometer process has become the most popular node among mature processes. It boasts the highest utilization rates and the…
Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks
Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with…
Commentary: Nvidia’s Groq deal reshapes semiconductor industry in 3 key ways
The biggest recent news in AI chip development is Nvidia’s non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion…
Samsung reportedly explores side-by-side chip packaging for next-gen Exynos
Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,…