Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design firms amid intensifying US-China trade tensions. Effective January 31, 2025, products using 16/14nm and below technologies must be packaged by a US Bureau of Industry and Security (BIS)-certified third-party OSAT (Outsourced Semiconductor Assembly and Test) provider. Furthermore, TSMC requires an official certification copy from the approved packaging firm before proceeding with shipments, with deliveries halted if documentation is not provided.