Taiwan’s MPI Corporation is set to benefit from a major shift in semiconductor testing, as global cloud providers ramp up custom AI chip development and drive demand for advanced wafer probe cards. Starting in 2026, Google and Amazon Web Services (AWS) are expected to lead a surge in CoWoS advanced packaging capacity, powered by their in-house AI application-specific integrated circuits (ASICs). These chips have already progressed from 7nm to 5nm and 4nm, with the next wave targeting sub-3nm nodes.