Co-tech Development is shifting further into high-performance copper foil for AI servers and 5G networks, confirming it will discontinue standard-grade foil production by early 2026. The transition comes as demand surges for high-frequency, high-speed ultra-low-profile (hyper very low profile; HVLP) copper foil used in copper-clad laminates (CCL), with supply already tight. Currently, only Mitsui Mining & Smelting of Japan and Taiwan-based Co-tech are the dominant global suppliers.