Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical inspection equipment. Chairman Peter Chin said the product passed foundry customer validation and secured the first order for a non-destructive through-silicon via (TSV) inspection system, slated for shipment and revenue contribution in the first half of 2026. This milestone marks the group’s transition into a new business phase.