Zhen Ding Technology Group (ZDT), the world’s largest printed circuit board (PCB) manufacturer, returned to SEMICON Taiwan 2025 to highlight how the AI boom is reshaping PCBs from passive circuit carriers into critical enablers of computing power. Chairman Charles Shen said AI-driven advanced packaging is emerging as a core growth engine for the industry, adding that with chip complexity rising and 3D packaging gaining ground, PCBs now play a decisive role in unlocking full processing performance.