Nvidia’s new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification. Key suppliers involved in early development include Taiwan’s Zhen Ding Technology Holding, Unimicron Technology Corp., and Compeq Manufacturing Co., along with China’s WUS Printed Circuit (Kunshan) Co. and Victory Giant Technology (HuiZhou) Co.