Manz, a pioneering company in semiconductor equipment, is ramping up its efforts to advance Chip-on-Panel-on-Substrate (CoPoS) technology, aiming for commercialization and broader application potential. Robert Lin, general manager of Manz Asia, disclosed that the company has set up a Semiconductor Innovation R&D Center in Taoyuan, Taiwan. This cutting-edge facility is designed to accommodate both experimental work and large-scale production of CoPoS redistribution layer (RDL) equipment.