China’s glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in yield and process control, these efforts aim to meet growing AI server and high-performance computing (HPC) chip packaging demands, marking a critical step toward technological self-reliance.

3D Chips introduced its “TGV 3.0” process, successfully overcoming technical challenges of sub-10-micron vias and high aspect ratio filling.