LG Electronics advances HBM and glass substrate equipment for advanced packaging
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The…
Foxconn’s FIT to ramp up AirPods manufacturing, doubling Hyderabad workforce
Amid growing speculation over Apple’s deepening manufacturing push in India, Foxconn Interconnect Technology (FIT), a wholly owned subsidiary of the…
Taiwan’s PCB makers enter ‘AI moment’ as complexity nears semiconductor levels
The development of artificial intelligence (AI) chips has brought the printed circuit board (PCB) and semiconductor industries closer together. Zhen…
Korea’s thinnest parking robot steals the show at FIX 2025
At the Future Innovation Technology Expo (FIX 2025) in Daegu, one of the busiest booths belongs to HL Robotics, whose…
Reliance and Meta launch joint venture to build India’s enterprise AI future
Reliance Industries announced that its wholly owned subsidiary, Reliance Intelligence Ltd, has incorporated a new company, Reliance Enterprise Intelligence Ltd…
CXMT, Huawei align on HBM3 ahead of China’s 2026 AI memory leap
High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear…
LGES approaches China’s battery market with time compression, accumulation strategy
In the face of policy and capital competition pressure from Chinese companies, LG Energy Solution (LGES) is implementing a strategy…
LINE Taiwan reveals AI agent plans for 2026
After a three-year hiatus, LINE Taiwan held LINE CONVERGE 2025 on October 22 to outline upcoming operational priorities and outlook.…
Taiwan’s secret: A century of elite talent driving chips, electronics, and healthcare
Taiwan currently shines on the global stage with three standout industries: its healthcare system, electronics manufacturing services (EMS), and semiconductors.…