Raydium navigates tariff fog with stable 2Q outlook, bolstered by AMOLED and IT demand
Raydium Semiconductor Corporation reported consolidated revenue of NT$5.83 billion (approx. US$191.7 million) for the first quarter of 2025, up 2.4%…
WT Microelectronics sees minimal impact from US tariffs as semiconductor market rebounds in 2Q25
WT Microelectronics, a Taiwan-based IC distributor, reports that the impact of US tariffs on its operations remains minimal, as most…
TSMC sets April revenue record at US$11.55 billion; YTD tops US$33 billion
TSMC, the world’s top contract chipmaker, posted consolidated revenue of NT$349.57 billion (approx. US$11.55 billion) in April 2025, up 22.2%…
US and UK reach breakthrough trade agreement as Trump signals strategic realignment
On May 8, US President Donald Trump and British Prime Minister Keir Starmer jointly announced the near-finalization of a long-anticipated…
Lee Jae-Yong’s 10-year smart M&A strategy builds Samsung’s technology ecosystem
Over the past decade, Samsung Electronics executive chairman Lee Jae-Yong has leveraged global mergers and acquisitions (M&A) to transform Samsung…
WITS initiates acquisition plan to seek second growth curve
Wistron ITS (WITS) chairman and CEO Ching Hsiao pointed out that the model launched by DeepSeek brings a dawn of…
FX losses erase over 40% of Acer’s 1Q25 operating profit
Acer Inc. delivered solid operating results for the first quarter of 2025, but sharp foreign exchange losses undercut its profitability.…
Japan’s Denso, Rohm forge chip alliance targeting EVs and autonomous driving
On May 8, Japanese automotive parts supplier Denso and chipmaker Rohm Semiconductor announced a strategic partnership aimed at deepening collaboration…
Taiwan ODMs post record April; server momentum set to drive 2Q25 growth
Taiwan’s leading ODMs reported robust year-over-year revenue growth in April, driven by solid notebook and server shipments. Although early notebook…
Chiplets technology gains ground as global semiconductor giants invest in modular chip future
TSMC, Intel, Samsung Electronics, and Advanced Micro Devices (AMD) are backing the modular semiconductor approach that breaks down system-on-chip (SoC)…