To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing systems. The company announced three major products centered on developing AI chips’ key areas: integrated die-to-wafer hybrid bonding systems, gate-all-around (GAA) transistor-based advanced logic processes, high-bandwidth memory (HBM) DRAM, and cutting-edge packaging technologies that optimize chip performance, power consumption, and cost.